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Phase 0 - Empty Sockets and Power Distribution

Install: Three boards, empty sockets, all passive defaults and supply wiring. No active devices, including the Pico. Use the inventory and orientation table. This phase has no firmware target.

Wiring - Sockets and Rails

Feed three separate +5 V rails from one regulated supply-entry star and bond all grounds with short links. Confirm rail segments are continuous with a meter. Keep a separate Peripheral 3.3 V rail for Pico header 36, U7 and U10; leave any supply-module 3.3 V output disconnected.

Wire supply contacts from the fixed-pin table. External +5 V goes to the 1N5819 anode; its banded cathode goes to VSYS header 39. Leave VBUS header 40 open. Do not bypass the diode.

USB-C supply-entry module J1

The selected TYPE-C USB-to-pin female adapter is a USB-C breakout, not a 5 V regulator. Its product image specifies a 21.6 x 12.7 mm PCB body. The six header holes use confirmed standard breadboard 2.54 mm pitch, with 12.7 mm between the first and last hole centres (five gaps). Header offsets, mounting-hole geometry, USB connector overhang and assembled height remain unspecified. The separate DIP PCB implementation uses six soldered header pins, no module screw holes, and a photo-scaled outline that must be dry-fitted before fabrication. This Phase 0 procedure is for the breadboard; it uses the same VBUS/GND connections.

With the USB connector at the top, as in the product photo, the bottom pads read CC2, D+, D-, CC1, GND, VBUS from left to right. Wire by these printed labels, not assumed pin numbers:

J1 pad Project connection
VBUS External +5 V supply entry and D1 anode
GND Common circuit GND
CC2, D+, D-, CC1 Leave breakout pads externally unconnected

Use a regulated 5 V USB source. The breakout does not regulate the rail, negotiate a higher USB Power Delivery voltage, or provide adjustable current limiting. Verify that CC1 and CC2 each have the required 5.1 kOhm sink resistor to GND on the purchased module for USB-C-to-USB-C power; the photo alone is not an electrical specification. Do not count those onboard resistors as project startup pulls. Use a current-limited bench source or an external adjustable current limiter for the Phase 0 test below. J1 VBUS is not Pico VBUS: retain D1 to Pico VSYS and leave Pico header 40 open. The existing external-power-before-Pico-USB sequence still applies.

Passive-Component Installation

Keep external power and USB disconnected throughout installation. All IC sockets and the Pico socket strips remain empty. Fit 40 individual 10 kOhm resistors and 11 capacitors using the steps below.

Tick the Done box beside each component as you fit it. With JavaScript enabled, progress is saved in this browser on this device and restored when you return. It does not sync across devices; clearing site data removes it. Use Clear checklist to start again. Ticks record installation only, not electrical verification or a passed test gate.

How to use these connection instructions

  • A socket pin means the contact where that IC pin will go when the chip is fitted later. A Pico header pin is its physical header position, not its GP number.
  • Put a component lead into a free hole electrically connected to the named socket contact. Do not force two leads into one hole. If necessary, use a short jumper from that contact to a separate terminal strip.
  • On a BB830, A-E in one numbered row are connected together, and F-J in that row are a separate connected group. Adjacent rows are not connected. Both leads in the same connected group would short out the component.
  • Use the orientation table to identify socket pins. Do not guess universal hole coordinates: chip rotations differ, and the wide Z80/SRAM sockets do not straddle E/F like the narrow logic ICs.
  • Check each endpoint at the actual socket contact with a meter. Signal jumpers to other devices are added in later phases; the passive can be attached to its named socket now.

Step 1 - Fit seven local 100 nF ceramic capacitors

A local bypass capacitor supplies short bursts of current at an IC. Fit one beside each DIP socket's supply pin, with short connections to that supply contact and nearby common GND. These ceramic capacitors are not polarized: either lead can face GND. Use capacitors rated at least 10 V.

Done Board Capacitor Socket / device One lead connects to Other lead connects to
Core C1, 100 nF U1 Z80 VCC socket pin 11, +5 V Common GND, also connected to socket pin 29
Memory C2, 100 nF U2 SRAM VCC socket pin 32, +5 V Common GND, also connected to socket pin 16
Memory C3, 100 nF U3 HCT32 VCC socket pin 14, +5 V Common GND, also connected to socket pin 7
Core C4, 100 nF U4 AHCT244 VCC socket pin 20, +5 V Common GND, also connected to socket pin 10
Peripheral C5, 100 nF U7 LVC244 VCC socket pin 20, +3.3 V Common GND, also connected to socket pin 10
Peripheral C6, 100 nF U9 AHCT245 VCC socket pin 20, +5 V Common GND, also connected to socket pin 10
Peripheral C7, 100 nF U10 LVC245 VCC socket pin 20, +3.3 V Common GND, also connected to socket pin 10

The GND pin numbers identify the electrical connection; do not stretch the capacitor across the whole package to reach a distant GND pin. Use nearby GND with a short return path. The Pico module already has onboard decoupling; it is not an eighth DIP capacitor in this list.

Step 2 - Fit four bulk capacitors

Bulk capacitors support the supply rails. These are polarized: connect the positive lead to +5 V and the negative lead to GND. Identify polarity from the case markings, not just lead length. Use capacitors rated at least 10 V.

Done Capacitor Where to place it Positive lead Negative lead
C8, 22 uF Memory board, beside its +5 V supply feed Memory +5 V rail Memory GND rail
C9, 22 uF Core board, beside its +5 V supply feed Core +5 V rail Core GND rail
C10, 22 uF Peripheral board, beside its +5 V supply feed Peripheral +5 V rail, not +3.3 V Peripheral GND rail
C11, 100 uF Common supply entry, before the feed fans out to the three boards External +5 V entry Common GND entry

All four go across their supply and GND, not in series with the supply wire. They supplement the seven local ceramic capacitors, not replace them. The current parts list specifies no separate 3.3 V bulk capacitor; retain the local 100 nF capacitors at both LVC sockets.

Step 3 - Fit sixteen SRAM address pull-ups on Memory

For each row below, fit one individual 10 kOhm resistor. Connect one end to the Memory +5 V rail and the other end to the listed U2 SRAM socket pin. The resistor can face either way. Leave SRAM absent.

Done Signal SRAM socket pin Resistor's other end
A14 3 +5 V
A12 4 +5 V
A7 5 +5 V
A6 6 +5 V
A5 7 +5 V
A4 8 +5 V
A3 9 +5 V
A2 10 +5 V
A1 11 +5 V
A0 12 +5 V
A10 23 +5 V
A11 25 +5 V
A9 26 +5 V
A8 27 +5 V
A13 28 +5 V
A15 31 +5 V

Do not join the address pins together. A16, socket pin 2, connects to U4 output pin 3. U4 input pin 17 connects to Pico GP8, physical pin 11, with R24 (10 kOhm) from Pico pin 11 to GND. Do not ground A16 or U4 pin 17 directly.

Step 4 - Fit eight Z80 control pull-ups on Core

For each row below, fit one individual 10 kOhm resistor from the Core +5 V rail to the listed U1 Z80 socket contact. These define controls while the CPU is absent or its bus outputs are floating.

Done Signal Z80 socket pin Resistor's other end
INT# 16 +5 V
NMI# 17 +5 V
MREQ# 19 +5 V
IORQ# 20 +5 V
RD# 21 +5 V
WR# 22 +5 V
BUSACK# 23 +5 V
BUSREQ# 25 +5 V

Step 5 - Fit twelve Pico pull-downs on Peripheral

For each row below, fit one individual 10 kOhm resistor from the listed empty Pico header contact to Peripheral GND. This group contains four startup pull-downs and eight data pull-downs. Each pin has its own resistor. All twelve connect to GND, not to either positive supply rail.

Done Signal / GPIO (reference) Physical Pico header pin Resistor's other end Default
CLK output, GP2 (R21) 4 GND LOW
RESET# output, GP3 (R22) 5 GND LOW, reset asserted
IO_RELEASE, GP9 (R23) 12 GND LOW
SRAM bank select, GP8 (R24) 11 GND LOW, bank 0
D0, GP10 14 GND LOW
D1, GP11 15 GND LOW
D2, GP12 16 GND LOW
D3, GP13 17 GND LOW
D4, GP14 19 GND LOW
D5, GP15 20 GND LOW
D6, GP16 21 GND LOW
D7, GP17 22 GND LOW

The GP10-GP17 pulls keep the Pico-side data inputs defined before firmware drives them. They are not pulls on the 5 V Z80 data bus. Keep these eight resistors near the Pico/data-translator region. Later data jumpers join these contacts to U9/U10 A pins; do not add a second set of pull-downs at those devices.

Step 6 - Fit four Pico pull-ups on Peripheral

For each row below, fit one individual 10 kOhm resistor from the listed empty Pico header contact to Peripheral +3.3 V, not +5 V or GND. The 3.3 V rail remains unpowered until the Pico is fitted in Phase 1 and supplies it from header pin 36.

Done Signal / GPIO (reference) Physical Pico header pin Resistor's other end Default
BUSREQ# output, GP4 (R17) 6 +3.3 V HIGH
BOOT_READ_DISABLE, GP5 (R18) 7 +3.3 V HIGH
Upward OE# request, GP6 (R19) 9 +3.3 V HIGH, path disabled
Downward OE#, GP7 (R20) 10 +3.3 V HIGH, path disabled

Step 7 - Connect all IC grounds and grounded fixed pins

These are direct wire links, not additional resistors. Connect every listed empty socket contact to common GND. The checklist includes each IC's power ground, permanently enabled buffer controls, unused inputs, and the downward translator's fixed direction. SRAM A16 and U4 pin 17 are part of the bank-select signal path and are not grounded directly.

The Pico rows use physical header pin numbers, not GPIO numbers. Connect these empty header contacts now while the Pico is absent; Phase 1 checks them again before fitting it. Connect AGND pin 33 to the same common GND.

If already fitted during supply or capacitor wiring, verify continuity at the actual socket contact before ticking it. A capacitor to nearby GND does not replace the IC's direct power-ground connection.

Done Board / socket Pin Function Connect directly to
Core / U1 Z80 29 Power GND Common GND
Core / U4 AHCT244 1 OE#, permanently enabled Common GND
Core / U4 AHCT244 10 Power GND Common GND
Core / U4 AHCT244 15 Unused input Common GND
Core / U4 AHCT244 19 OE#, permanently enabled Common GND
Memory / U2 SRAM 16 Power GND Common GND
Memory / U3 HCT32 7 Power GND Common GND
Memory / U3 HCT32 12 Unused input Common GND
Memory / U3 HCT32 13 Unused input Common GND
Peripheral / Pico header 3 GND Common GND
Peripheral / Pico header 8 GND Common GND
Peripheral / Pico header 13 GND Common GND
Peripheral / Pico header 18 GND Common GND
Peripheral / Pico header 23 GND Common GND
Peripheral / Pico header 28 GND Common GND
Peripheral / Pico header 33 AGND (analog ground) Common GND
Peripheral / Pico header 38 GND Common GND
Peripheral / U7 LVC244 1 OE#, permanently enabled Common GND
Peripheral / U7 LVC244 10 Power GND Common GND
Peripheral / U7 LVC244 19 OE#, permanently enabled Common GND
Peripheral / U9 AHCT245 10 Power GND Common GND
Peripheral / U10 LVC245 1 DIR, fixed B to A Common GND
Peripheral / U10 LVC245 10 Power GND Common GND

Leave U3 output pin 11 and U4 output pins 3 and 5 open; do not ground them.

No resistor goes in these ground links. They do not change the resistor or capacitor totals below.

Step 8 - Connect IC supplies and fixed-HIGH pins

Keep external power and USB disconnected, with all devices absent. Fit or continuity-check each connection below at the actual socket contact. These are direct wire connections, not pull resistors. A bypass capacitor does not replace the direct supply connection.

Connections to +5 V

Done Board / socket Pin Function Connect directly to
Core / U1 Z80 11 VCC supply Core +5 V rail
Core / U4 AHCT244 20 VCC supply Core +5 V rail
Memory / U2 SRAM 30 CE2, fixed HIGH Memory +5 V rail
Memory / U2 SRAM 32 VCC supply Memory +5 V rail
Memory / U3 HCT32 14 VCC supply Memory +5 V rail
Peripheral / U9 AHCT245 1 DIR, fixed A to B Peripheral +5 V rail
Peripheral / U9 AHCT245 20 VCC supply Peripheral +5 V rail

Connections to Pico-derived +3.3 V

Done Board / socket Pin Function Connect directly to
Peripheral / Pico header 36 3V3 OUT, source of this rail Peripheral +3.3 V rail
Peripheral / U7 LVC244 20 VCC supply Peripheral +3.3 V rail
Peripheral / U10 LVC245 20 VCC supply Peripheral +3.3 V rail

The +3.3 V rail stays unpowered in Phase 0. In Phase 1 the fitted Pico supplies it from header pin 36; do not feed this rail from an external 3.3 V supply or connect either LVC supply pin to +5 V.

Pico power input through the isolation diode

Done Connection Required wiring
External +5 V to Pico VSYS, header pin 39 External +5 V to 1N5819 anode; banded cathode to header pin 39

Header pin 39 receives the diode-fed supply, not the +3.3 V rail. Leave VBUS header pin 40 externally unconnected and do not bypass the diode. These wire connections do not change the resistor or capacitor totals.

Installation count before testing

IC / component group Permanent resistors External capacitors GND pins +5 V pins +3.3 V pins
Pico 2 W 16: twelve pull-downs plus four pull-ups None 8 0 1
U1 Z80 Eight CPU control pull-ups C1, 100 nF 1 1 0
U2 SRAM 16 address pull-ups C2, 100 nF 1 2 0
U3 HCT32 None C3, 100 nF 3 1 0
U4 AHCT244 None C4, 100 nF 4 1 0
U7 LVC244 None C5, 100 nF 3 0 1
U9 AHCT245 None C6, 100 nF 1 2 0
U10 LVC245 None C7, 100 nF 2 0 1
Board bulk capacitors None C8-C10, three 22 uF 0 0 0
Common supply entry None C11, 100 uF 0 0 0
Total 40 individual 10 kOhm resistors 11 capacitors 23 7 3

The pin columns count the direct socket/header connections in Steps 7 and 8, including grounded or fixed-HIGH control pins. They do not count resistor or capacitor leads, rail bridges, or supply-entry wiring. The Pico counts include all eight ground contacts and its 3.3 V output pin 36. There is one additional diode-fed Pico VSYS connection at header pin 39; it is not a direct +5 V connection and is not included in the +5 V column. Resistors are counted once at their installation point: Pico pulls at the Pico, CPU control pulls at U1, and address pulls at U2, even though the signal nets also connect to other ICs. The Pico's onboard capacitors are not included in the 11 external capacitors.

Leave all permanent resistors and capacitors installed for subsequent phases. Temporary diagnostic pulls are added only when a later phase requests them.

Power Distribution and Isolation

  • Apply external +5 V before USB; unplug USB before removing external +5 V. Do not operate a populated board from USB alone: U9 data ports lack Ioff. Program a removed Pico off-board if USB-only programming is needed.
  • All fitted 5 V ICs must be powered together. A fitted unpowered device is not equivalent to an empty socket. Pull resistors do not isolate it.
  • Never connect a 5 V output directly to a Pico GPIO. Both LVC devices run from Pico 3.3 V, not from +5 V. During ramp, asserted RESET and stopped clock prevent execution; RAM is indeterminate until loaded and verified.
  • Arbitrary external-power loss with USB attached is not protected. Add hardware isolation in a separately reviewed redesign if that is required.
  • Power and USB must be disconnected before changing wiring or measuring resistance. Stop on a collapsed rail, excessive current, or warm device.

Test Plan

  1. With everything disconnected, verify every socket power contact, diode polarity, capacitor polarity, and no +5 V/3.3 V/GND short. Let capacitor resistance readings settle; inspect any near-zero sustained resistance. Check each of the 40 resistor paths from its named socket/header contact to its specified rail: expect approximately 10 kOhm with devices absent. The direct GND links should have continuity, not 10 kOhm. If a resistor reading is unexpected, inspect parallel wiring paths and isolate one resistor lead with power disconnected if needed to verify its value.
  2. With active devices absent, apply +5 V using a 100 mA initial limit. Measure 4.75-5.25 V at every 5 V socket; the unpowered 3.3 V rail must not be driven. Remove power if a rail droops more than 5% or the limit trips.
  3. Record resistance, voltage, and unloaded current. Disconnect power and confirm discharge before fitting the Pico in Phase 1.

Pass Gate

Correct polarity and supplies at all contacts, no shorts, no unexpected current, and all startup resistors fitted. A blank board's voltage test does not establish loaded-regulator performance; repeat measurements each phase.